MMBFJ175LT1G;MMBFJ175LT1;中文规格书,Datasheet资料
? Semiconductor Components Industries, LLC, 2009 August, 2009 ? Rev. 51Publication Order Number:
MMBFJ175LT1/D
MMBFJ175LT1G
JFET Chopper
P?Channel ? Depletion
Features
?These Devices are Pb?Free, Halogen Free/BFR Free and are RoHS Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit Drain?Gate Voltage V DG25V Reverse Gate?Source Voltage V GS(r)?25V THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR?5 Board, (Note 1) T A = 25°C
Derate above 25°C P D
225
1.8
mW
mW/°C
Thermal Resistance, Junction?to?Ambient R q JA556°C/W Junction and Storage Temperature T J, T stg?55 to +150°C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.FR?5 = 1.0 x 0.75 x 0.062 in.
ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS
Gate?Source Breakdown Voltage
(V DS = 0,I D = 1.0 m A)
V(BR)GSS30?V
Gate Reverse Current
(V DS = 0 V, V GS = 20 V)
I GSS? 1.0nA
Gate?Source Cutoff Voltage
(V DS = 15, I D = 10 nA)
V GS(OFF) 3.0 6.0V ON CHARACTERISTICS
Zero Gate?Voltage Drain Current (Note 2)
(V GS = 0, V DS = 15 V)
I DSS7.060mA
Drain Cutoff Current
(V DS = 15 V, V GS = 10 V)
I D(off)? 1.0nA
Drain Source On Resistance
(I D = 500 m A)
r DS(on)?125W
Input Capacitance
V DS = 0, V GS = 10V
f = 1.0 MHz C iss?11
pF
Reverse Transfer
Capacitance
C rss? 5.5
2.Pulse Test: Pulse Width v 300 m s, Duty Cycle v 2.0%.
https://www.sodocs.net/doc/b615270089.html,
SOT?
23 (TO?236)
CASE 318
STYLE 10
Device Package Shipping?
ORDERING INFORMATION
?For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.
MMBFJ175LT1G SOT?23
(Pb?Free)
3000 / Tape & Reel *Date Code orientation and/or overbar may
vary depending upon manufacturing location.
1
6W M G
G
6W= Device Code
M= Date Code*
G= Pb?Free Package
(Note: Microdot may be in either location)
MARKING DIAGRAM
3
1 DRAIN
MMBFJ175LT1G
PACKAGE DIMENSIONS
SOT ?23 (TO ?236)CASE 318?08ISSUE AN
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198
2.
2.CONTROLLING DIMENSION: INCH.
3.MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4.318?01 THRU ?07 AND ?09 OBSOLETE, NEW STANDARD 318?08.
VIEW C
DIM A MIN NOM MAX MIN MILLIMETERS
0.89 1.00 1.110.035INCHES
A10.010.060.100.001b 0.370.440.500.015c 0.090.130.180.003D 2.80 2.90 3.040.110E 1.20 1.30 1.400.047e 1.78 1.90 2.040.070L 0.100.200.300.0040.0400.0440.0020.0040.0180.0200.0050.0070.1140.1200.0510.0550.0750.0810.0080.012NOM MAX L1 2.10 2.40 2.64
0.0830.094
0.104
H E 0.350.540.690.0140.0210.029*For additional information on our Pb ?Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
STYLE 10:
PIN 1.DRAIN
2.SOURCE
3.GATE
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
分销商库存信息:
ONSEMI
MMBFJ175LT1G MMBFJ175LT1