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ULC0404FC3.3C中文资料

ULC0404FC3.3C中文资料
ULC0404FC3.3C中文资料

ULC0404FC3.3C

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ULC0404FC36C

UNBUMPED LOW CAP ACIT ANCE FLIP CHIP ARRA Y

Only One Name Means ProT

ek’Tion?

APPLICA TIONS ? Cellular Phones

? Personal Digital Assistant (PDA)? Notebook Computers ? SMART Cards

IEC COMP A TIBILITY (EN61000-4)? 61000-4-2 (ESD): Air - 15kV , Contact - 8kV ? 61000-4-4 (EFT): 40A - 5/50ns FEA TURES

? ESD Protection > 25 kilovolts

? Available in Voltages Ranging From 3.3V to 36V ? 200 Watts Peak Pulse Power per Line (tp = 8/20μs)? Low Clamping Voltage

? Bidirectional Configuration & Monolithic Structure ? Protects 1 to 3 Lines ? LOW CAPACITANCE

? LOW LEAKAGE CURRENT ? RoHS Compliant

MECHANICAL CHARACTERISTICS ? Standard EIA Chip Size: 0404

? Weight 0.73 milligrams (Approximate)? Solder Reflow T emperature:

Tin-Lead: 240-245°C Lead-Free: 260-270°C

? Flammability Rating UL 94V-0

? 8mm Plastic & Paper Tape and Reel Per EIA Standard 481? Device Marking On Reel

U0404

(Single Chip Shown)

05168

PIN CONFIGURA

TION

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ULC0404FC36C

DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

Operating T emperature SYMBOL VALUE -55°C to 150°C

°C

°C -55°C to 150°C UNITS T J T STG

PARAMETER

Storage T emperature

Peak Pulse Power (t p = 8/20μs) - See Figure 1P PP 200Watts 0 5 10 15 20 25 30

t - Time - μs

20406080100120I P P - P e a k P u l s e C u r r e n t - % o f I

P P

FIGURE 2

0.01 1 10 100 1,000 10,000

t d - Pulse Duration - μs

10

100

1,000

10,000

P P P - P e

a k P u l s e C u r r e n t - W a t t s

FIGURE 1

PEAK PULSE POWER VS PULSE TIME

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PART NUMBER (See Note 1)

MINIMUM BREAKDOWN VOLTAGE

@ 1mA V (BR)VOLTS MAXIMUM CLAMPING VOLTAGE (See Fig. 2)@ I P = 1A

V C VOLTS MAXIMUM CLAMPING VOLTAGE (See Fig. 2)

@8/20μs V C @ I PP TYPICAL CAPACITANCE

@0V, 1 MHz

C pF

ULC0404FC3.3C ULC0404FC05C ULC0404FC08C ULC0404FC12C ULC0404FC15C ULC0404FC24C ULC0404FC36C

3.35.98.012.015.02

4.036.0

4.06.08.513.316.726.740.0

7.011.013.219.825.437.270.0

12.5V @ 16A 13V @ 15A 18V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 80.0V @ 2.5A

70353230252018

MAXIMUM LEAKAGE CURRENT (See Note 2)

@V WM

I D μA 75*10**11111

RATED ST AND-OFF VOLTAGE

V WM VOLTS

Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.

Note 2: *Maximum leakage current < 5μA @ 2.8V. **Maximum leakage current <500nA @ 3.3V .

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ULC0404FC36C

GRAPHS

0 5 10 15 20

V C - C l a m p i n g V o l t a g e - V o l t s

481214FIGURE 5

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR ULC0404FC05C

1062I PP - Peak Pulse Current - Amps

ESD T est Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 4

OVERSHOOT & CLAMPING VOLTAGE FOR ULC0404FC05C

5 V o l t s p e r D i v i s i o n

-5

5

15

25

35

T L - Lead Temperature - °C

20

406080100% O f R a t e d P o w e r

FIGURE 3

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T T e m p e r a t u r e - °C

T 0.275mm Round

Non-Solder Mask Defined Pads 0.325mm Round 0.150mm

0.330mm Round No Clean

OSP(Entek Cu Plus 106A)±50μm ±20μm

60 Seconds 270°C

Pad Size on PCB

Pad Shape Pad Definition

Solder Mask Opening Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)Solder Paste Type Pad Protective Finish

Tolerance - Edge T o Corner Ball Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous (183°C)Soldering Maximum Temperature

PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER

VALUE

REQUIREMENTS

Temperature:

T P for Lead-Free (SnAgCu): 260-265°C T P for Tin-Lead: 240-245°C

Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area &plating.

RECOMMENDED NON-SOLDER MASK

DEFINED PAD ILLUSTRATION

Solder Mask Opening

0.325mm DIA.

Solder Stencil Opening

0.330mm DIA.

APPLICA TION INFORMA TION

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ULC0404FC36C P ACKAGE OUTLINE & DIMENSIONS

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ULC0404FC36C

P ACKAGE OUTLINE & DIMENSIONS

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282Tel: 602-431-8101 Fax: 602-431-2288E-Mail: sales@https://www.sodocs.net/doc/2b3487328.html, Web Site: https://www.sodocs.net/doc/2b3487328.html,

COPYRIGHT ? ProTek Devices 2005

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and

specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.

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