MPX2010_IcpdfCom_749632
MPX2010Rev 11, 11/2006
Freescale Semiconductor Technical Data
? Freescale Semiconductor, Inc., 2006. All rights reserved.
10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors
The MPX2010/MPXV2010G series silicon piezoresistive pressure sensors provide a very accurate and linear voltage output directly proportional to the applied pressure. These sensors house a single monolithic silicon die with the strain gauge and thin film resistor network integrated on each chip. The sensor is laser trimmed for precise span, offset calibration and temperature compensation.Features
?Temperature Compensated over 0°C to +85°C ?Ratiometric to Supply Voltage ?Differential and Gauge Options Typical Applications
?Respiratory Diagnostics ?Air Movement Control ?Controllers
?Pressure Switching
ORDERING INFORMATION
Device Type Options
Case No.
MPX Series Order No.Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV2010G SERIES)
Ported Elements
Gauge, Side Port, SMT 1369MPXV2010GP Trays MPXV2010G Differential, Dual Port, SMT
1351
MPXV2010DP
Trays
MPXV2010G
UNIBODY PACKAGE (MPX2010 SERIES)
Basic Element Differential 344MPX2010D —MPX2010D Ported Elements
Differential, Dual Port 344C MPX2010DP —MPX2010DP
Gauge 344B MPX2010GP —MPX2010GP Gauge, Axial 344E MPX2010GS —MPX2010D Gauge, Axial PC Mount
344F
MPX2010GSX
—
MPX2010D
MPX2010MPXV2010G SERIES
SMALL OUTLINE PACKAGE
PIN NUMBERS
1GND (1)5N/C 2+V OUT 6N/C 3V S 7N/C 4
–V OUT
8
N/C
1. Pin 1 in noted by the notch in the lead.
COMPENSATED PRESSURE SENSOR 0 to 10 kPa (0 to 1.45 psi) FULL SCALE SPAN: 25 mV
SMALL OUTLINE PACKAGES
MPXV2010GP CASE 1369-01 MPXV2010DP CASE 1351-01
UNIBODY PACKAGE PIN NUMBERS
1GND (1)1. Pin 1 in noted by the notch in the lead.
3V S 2
+V OUT
4
–V
OUT
UNIBODY PACKAGES
MPX2010GS CASE 344E-01MPX2010GSX CASE 344F-01
MPX2010GP CASE 344B-01MPX2010DP CASE 344C-01MPX2010GP CASE 344-15
MPX2010Sensors
Figure 1. Temperature Compensated and Calibrated
Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1).
Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
+V OUT –V OUT
4
2V S 3
Sensing Element
GND
1Thin Film Temperature Compensation and Calibration Circuitry
Table 1. Maximum Ratings (1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating
Symbol Value Unit Maximum Pressure (P1 > P2)P MAX 75kPa Storage Temperature T STG –40 to +125°C Operating Temperature
T A
–40 to +125
°C
MPX2010
Sensors
Table 2. Operating Characteristics (V S = 10 V DC , T A = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol Min Typ Max Units Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.
P OP 0—10kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. V S —1016V DC Supply Current I O — 6.0—mAdc Full Scale Span (3)3.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure.V FSS 242526mV Offset (4)4.Offset (V OFF ) is defined as the output voltage at the minimum rated pressure.V OFF –1.0— 1.0mV Sensitivity ?V/?Ρ— 2.5—mV/kPa Linearity (5)
5.Accuracy (error budget) consists of the following:
?Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.
?Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
?Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
?TcSpan:Output deviation over the temperature range of 0° to 85°C, relative to 25°C.?TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.?Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of V FSS , at 25°C.
—–1.0— 1.0%V FSS Pressure Hysteresis (5) (0 to 50 kPa)
——±0.1—%V FSS Temperature Hysteresis (5) (–40°C to +125°C)——±0.5—%V FSS Temperature Effect on Full Scale Span (5) TCV FSS –1.0— 1.0%V FSS Temperature Effect on Offset (5) TCV OFF –1.0— 1.0mV Input Impedance Z IN 1000—2550W Output Impedance
Z OUT 1400—3000W Response Time (6) (10% to 90%)6.Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. t R — 1.0—ms Warm-Up Time —— 2.0—ms Offset Stability (7)
7.Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
—
—
±0.5
—
%V FSS
MPX2010Sensors
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 2. Output vs. Pressure Differential
Figure 2 shows the output characteristics of the MPX2010/MPXV2010G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a straight line.
The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics.
This performance over temperature is achieved by having both the shear stress strain gauge and the thin-film resistor circuitry on the same silicon diaphragm. Each chip is dynamically laser trimmed for precise span and offset calibration and temperature compensation.
Figure 3. Unibody Package: Cross Sectional Diagram (Not to Scale)
Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm.The MPX2010/MPXV2010G series pressure sensor operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application.
Offset (Typical)
O u t p u t (m V d c )
kPa PSI
2.50.36250.7257.51.09101.45
Span Range (Typical)
V S = 10 Vdc T A = 25°C P1 > P2
302520151050–5TYP
a
MAX
MIN
Silicone Die Coat
Die
P1
P2
Wire Bond
Lead Frame
RTV Die Bond
Epoxy Case
Stainless Steel Metal Cover
MPX2010
Sensors
LINEARITY
Linearity refers to how well a transducer's output follows the equation: V out = V off + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2)a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.
Figure 4. Linearity Specification Comparison
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the following table.
R e l a t i v e V o l t a g e O u t p u t
Pressure (% Full Scale)
Table 3. Pressure (P1) Side Delineation
Part Number Case Type
Pressure (P1) Side Identifier MPX2010D 344Stainless Steep Cap MPX2010DP 344C Side with Part Marking MPX2010GP 344B Side with Port Attached MPX2010GS 344E Side with Port Attached MPX2010GSX 344F Side with Port Attached MPXV2010GP 1369Side with Port Attached MPXV2010DP
1351
Side with Part Marking
ISSUE AA
UNIBODY PACKAGE
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2010
Sensors
ISSUE B
UNIBODY PACKAGE
CASE 344E-01
ISSUE B
UNIBODY PACKAGE
MPX2010 Sensors
CASE 344F-01
ISSUE B
UNIBODY PACKAGE
MPX2010
Sensors
CASE1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2010 Sensors
CASE1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2010
Sensors
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2010 Sensors
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2010
Sensors
NOTES
MPX2010 Sensors
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