MPXV7025Rev 5, 1/2009
Freescale Semiconductor
? Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
Pressure
+
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXV7025 series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.
Features
? 5.0% Maximum Error Over 0° to 85°C
?Ideally Suited for Microprocessor or Microcontroller-Based Systems ?Temperature Compensated Over –40° to +125°C ?Thermoplastic (PPS) Surface Mount Package ?Patented Silicon Shear Stress Strain Gauge
?
Available in Differential and Gauge Configurations
ORDERING INFORMATION
Device Name Package Options
Case
No.# of Ports
Pressure Type Device
Marking None
Single
Dual
Gauge
Differential Absolute
Small Outline Package (MPXV7025 Series)MPXV7025GC6U Rails 482A ??MPXV 7025G MPXV 7025GC6T1Tape & Reel 482A
??MPXV 7025G MPXV 7025GP Trays
1369
?
?
MPXV 7025GP
MPXV 7025DP
Trays 1351
?
?
MPXV 7025DP Small Outline Package (Media Resistant Gel) (MPVZ7025 Series)MPVZ7025GC6T1Tape & Reel 482A ??MPVZ7025G MPVZ7025GC6U Rails 482A ??MPVZ7025G MPVZ7025GP Trays 1369?
?
MPVZ7025GP MPVZ7025G6T1Tape & Reel
482?
?MPVZ7025G MPVZ7025G6U Rails 482?
?MPVZ7025G MPVZ7025DP
Trays
1351
?
?
MPVZ7025DP
MPXV7025Series
-25 to 25 kPa (-3.6 to 3.6 psi)
0.2 to 4.7 V Output
SMALL OUTLINE PACKAGE
MPXV7025GC6U/T1CASE 482A-01
MPXV7025DP MPXV7025GP MPVZ7025G6U/T1CASE 482-01
MPVZ7025GC6U/T1CASE 1369-01MPVZ7025GP CASE 1351-01
MPVZ7025DP Application Examples
?Respiratory Systems ?Process Control ?Patient Monitoring
?
Remote Monitoring Devices
MPXV7025Sensors
Pressure
Operating Characteristics
Table 1. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic
Symbol Min Typ Max Unit Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.
P OP -25—25kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range.
V S 4.75 5.0 5.25Vdc Supply Current
I o —7.010mAdc Minimum Pressure Offset (3)(0 to 85°C)
@ V S = 5.0 Volts 3.Offset (V off ) is defined as the output voltage at the minimum rated pressure.
V off
0.116
0.25
0.384
Vdc
Full Scale Output (4)(0 to 85°C)
@ V S = 5.0 Volts 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.
V FSO
4.610 4.75 4.890Vdc
Full Scale Span (5)(0 to 85°C)@ V S = 5.0 Volts 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS
— 4.5—Vdc
Accuracy (0 to 85°C)
———±5.0%V FSS Sensitivity V/P —90—-mV/kPa Response Time (6)
6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—-ms Output Source Current at Full Scale Output I o+—0.1—-mAdc Warm-Up Time (7)
7.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.——20—-ms Offset Stability (8)
8.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
—
—
±0.5
—-
%V FSS
MPXV7025
Sensors
Pressure
Maximum Ratings
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Figure 1. Integrated Pressure Sensor Schematic
Table 2. Maximum Ratings (1)
1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating
Symbol Value Unit Maximum Pressure (P1 > P2)P max 200kPa Storage Temperature T stg –40 to +125°C Operating Temperature
T A
–40 to +125
°C
Sensing Element
Thin Film Temperature Compensation
and Gain Stage #1Gain Stage #2
and Ground Reference Shift Circuitry
V S V out
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device
2
3
4
MPXV7025Sensors
Pressure
On-chip Temperature Compensation and Calibration
The MPXV7025 series pressure sensor operating
characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.
Figure 2. Output versus Pressure Differential
Figure 3. Recommended Power Supply Decoupling
and Output Filtering
(For additional output filtering, please refer to
Application Note AN1646.))
Differential Pressure (kPa)
O u t p u t (V )
5.0
4.54.03.53.02.52.01.51.00.500
25
Transfer Function:
V out = V S *(0.018*P+0.5) ± ERROR V S = 5.0 Vdc
TEMP = 0 to 85°C TYPICAL
MIN
MAX
-25
+5 V
1.0 μF
0.01 μF
470 pF
GND
V s
V out
IPS
OUTPUT
MPXV7025
Sensors
Pressure
Nominal Transfer Value:V out = V S (P x 0.018 + 0.5)
± (Pressure Error x Temp. Factor x 0.018 x V S )V S = 5.0 V ± 0.25 Vdc
Transfer Function
MPXV7025 SERIES
Temp Multiplier –403 0 to 851 +125
3
Temperature in °C
4.03.0
2.00.0
1.0–40
–20
20
40
60
140
120
100
80
Temperature Error Factor
NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Temperature Error Band
Pressure Error (Max)Pressure Error Band
-25 to 25 (kPa)
±1.25 (kPa)
Error Limits for Pressure
Pressure (in kPa)
3.02.01.0–1.0–2.0–3.0
0.00
-25
P r e s s u r e E r r o r (k P a )
25
MPXV7025Sensors
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The pressure
sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the following table:
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct
footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
Figure 4. Small Outline Package Footprint
Part Number
Case Type
Pressure (P1)Side Identifier
MPXV7025GC6U/C6T1, MPVZ7025GC6U/T1482A Side with Port Attached MPXV7025GP, MPVZ7025GP 1369Side with Port Attached MPXV7025DP, MPVZ7025DP 1351Side with Part Marking MPVZ7025G6U/T1
482
Side with Part Marking
0.66016.76
0.060 TYP 8X 1.52
0.100 TYP 8X 2.54
0.100 TYP 8X 2.54
0.3007.62
inch mm
SCALE 2:1
Pressure
PACKAGE DIMENSIONS
ISSUE A
SMALL OUTLINE PACKAGE
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
MPXV7025 Sensors
Pressure
PACKAGE DIMENSIONS
ISSUE O
SMALL OUTLINE PACKAGE
MPXV7025
Sensors
Pressure
PACKAGE DIMENSIONS
ISSUE O
SMALL OUTLINE PACKAGE
MPXV7025 Sensors
MPXV7025Rev. 5How to Reach Us:
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分销商库存信息: FREESCALE MPVZ7025DP