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MPVZ7025DP;中文规格书,Datasheet资料

MPXV7025Rev 5, 1/2009

Freescale Semiconductor

? Freescale Semiconductor, Inc., 2007-2009. All rights reserved.

Pressure

+

Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

The MPXV7025 series piezoresistive transducer is a state-of-the-art

monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced

micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.

Features

? 5.0% Maximum Error Over 0° to 85°C

?Ideally Suited for Microprocessor or Microcontroller-Based Systems ?Temperature Compensated Over –40° to +125°C ?Thermoplastic (PPS) Surface Mount Package ?Patented Silicon Shear Stress Strain Gauge

?

Available in Differential and Gauge Configurations

ORDERING INFORMATION

Device Name Package Options

Case

No.# of Ports

Pressure Type Device

Marking None

Single

Dual

Gauge

Differential Absolute

Small Outline Package (MPXV7025 Series)MPXV7025GC6U Rails 482A ??MPXV 7025G MPXV 7025GC6T1Tape & Reel 482A

??MPXV 7025G MPXV 7025GP Trays

1369

?

?

MPXV 7025GP

MPXV 7025DP

Trays 1351

?

?

MPXV 7025DP Small Outline Package (Media Resistant Gel) (MPVZ7025 Series)MPVZ7025GC6T1Tape & Reel 482A ??MPVZ7025G MPVZ7025GC6U Rails 482A ??MPVZ7025G MPVZ7025GP Trays 1369?

?

MPVZ7025GP MPVZ7025G6T1Tape & Reel

482?

?MPVZ7025G MPVZ7025G6U Rails 482?

?MPVZ7025G MPVZ7025DP

Trays

1351

?

?

MPVZ7025DP

MPXV7025Series

-25 to 25 kPa (-3.6 to 3.6 psi)

0.2 to 4.7 V Output

SMALL OUTLINE PACKAGE

MPXV7025GC6U/T1CASE 482A-01

MPXV7025DP MPXV7025GP MPVZ7025G6U/T1CASE 482-01

MPVZ7025GC6U/T1CASE 1369-01MPVZ7025GP CASE 1351-01

MPVZ7025DP Application Examples

?Respiratory Systems ?Process Control ?Patient Monitoring

?

Remote Monitoring Devices

MPXV7025Sensors

Pressure

Operating Characteristics

Table 1. Operating Characteristics (V S = 5.0 Vdc, T A = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.)

Characteristic

Symbol Min Typ Max Unit Pressure Range (1)1. 1.0 kPa (kiloPascal) equals 0.145 psi.

P OP -25—25kPa Supply Voltage (2)2.Device is ratiometric within this specified excitation range.

V S 4.75 5.0 5.25Vdc Supply Current

I o —7.010mAdc Minimum Pressure Offset (3)(0 to 85°C)

@ V S = 5.0 Volts 3.Offset (V off ) is defined as the output voltage at the minimum rated pressure.

V off

0.116

0.25

0.384

Vdc

Full Scale Output (4)(0 to 85°C)

@ V S = 5.0 Volts 4.Full Scale Output (V FSO ) is defined as the output voltage at the maximum or full rated pressure.

V FSO

4.610 4.75 4.890Vdc

Full Scale Span (5)(0 to 85°C)@ V S = 5.0 Volts 5.Full Scale Span (V FSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.V FSS

— 4.5—Vdc

Accuracy (0 to 85°C)

———±5.0%V FSS Sensitivity V/P —90—-mV/kPa Response Time (6)

6.Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure.t R — 1.0—-ms Output Source Current at Full Scale Output I o+—0.1—-mAdc Warm-Up Time (7)

7.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.——20—-ms Offset Stability (8)

8.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

±0.5

—-

%V FSS

MPXV7025

Sensors

Pressure

Maximum Ratings

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Figure 1. Integrated Pressure Sensor Schematic

Table 2. Maximum Ratings (1)

1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Rating

Symbol Value Unit Maximum Pressure (P1 > P2)P max 200kPa Storage Temperature T stg –40 to +125°C Operating Temperature

T A

–40 to +125

°C

Sensing Element

Thin Film Temperature Compensation

and Gain Stage #1Gain Stage #2

and Ground Reference Shift Circuitry

V S V out

GND

Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device

2

3

4

MPXV7025Sensors

Pressure

On-chip Temperature Compensation and Calibration

The MPXV7025 series pressure sensor operating

characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor

performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of 0° to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.

Figure 2. Output versus Pressure Differential

Figure 3. Recommended Power Supply Decoupling

and Output Filtering

(For additional output filtering, please refer to

Application Note AN1646.))

Differential Pressure (kPa)

O u t p u t (V )

5.0

4.54.03.53.02.52.01.51.00.500

25

Transfer Function:

V out = V S *(0.018*P+0.5) ± ERROR V S = 5.0 Vdc

TEMP = 0 to 85°C TYPICAL

MIN

MAX

-25

+5 V

1.0 μF

0.01 μF

470 pF

GND

V s

V out

IPS

OUTPUT

MPXV7025

Sensors

Pressure

Nominal Transfer Value:V out = V S (P x 0.018 + 0.5)

± (Pressure Error x Temp. Factor x 0.018 x V S )V S = 5.0 V ± 0.25 Vdc

Transfer Function

MPXV7025 SERIES

Temp Multiplier –403 0 to 851 +125

3

Temperature in °C

4.03.0

2.00.0

1.0–40

–20

20

40

60

140

120

100

80

Temperature Error Factor

NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.

Temperature Error Band

Pressure Error (Max)Pressure Error Band

-25 to 25 (kPa)

±1.25 (kPa)

Error Limits for Pressure

Pressure (in kPa)

3.02.01.0–1.0–2.0–3.0

0.00

-25

P r e s s u r e E r r o r (k P a )

25

MPXV7025Sensors

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The pressure

sensor is designed to operate with positive differential pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the following table:

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct

footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.

Figure 4. Small Outline Package Footprint

Part Number

Case Type

Pressure (P1)Side Identifier

MPXV7025GC6U/C6T1, MPVZ7025GC6U/T1482A Side with Port Attached MPXV7025GP, MPVZ7025GP 1369Side with Port Attached MPXV7025DP, MPVZ7025DP 1351Side with Part Marking MPVZ7025G6U/T1

482

Side with Part Marking

0.66016.76

0.060 TYP 8X 1.52

0.100 TYP 8X 2.54

0.100 TYP 8X 2.54

0.3007.62

inch mm

SCALE 2:1

Pressure

PACKAGE DIMENSIONS

ISSUE A

SMALL OUTLINE PACKAGE

CASE 482-01

ISSUE O

SMALL OUTLINE PACKAGE

MPXV7025 Sensors

Pressure

PACKAGE DIMENSIONS

ISSUE O

SMALL OUTLINE PACKAGE

MPXV7025

Sensors

Pressure

PACKAGE DIMENSIONS

ISSUE O

SMALL OUTLINE PACKAGE

MPXV7025 Sensors

MPXV7025Rev. 5How to Reach Us:

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Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.

Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be

provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or

unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale? and the Freescale logo are trademarks of Freescale Semiconductor, Inc.All other product or service names are the property of their respective owners.? Freescale Semiconductor, Inc. 2009. All rights reserved.

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