ANALOG
AUDIO
INPUT
?
?
?
TAS5630
https://www.sodocs.net/doc/622012041.html,.................................................................................................................................................SLES220A–JUNE2009–REVISED SEPTEMBER2009 300W STEREO/600W MONO PurePath?HD ANALOG-INPUT POWER STAGE
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FEATURES APPLICATIONS
?Mini Combo System
?PurePath?HD Enabled Integrated Feedback
Provides:?AV Receivers
?DVD Receivers
–Signal Bandwidth up to80kHz for High
Frequency Content From HD Sources?Active Speakers
–Ultralow0.03%THD at1W into4?
DESCRIPTION
–Flat THD at all Frequencies for Natural
Sound The TAS5630is a high performance analog input
Class D amplifier with integrated closed loop –80dB PSRR(BTL,No Input Signal)
feedback technology(known as PurePath?HD)with –>100dB(A weighted)SNR the ability to drive up to300W
(1)Stereo into4to8?
–Click and Pop Free Startup Speakers from a single50V supply.
?Multiple Configurations Possible on the Same PurePath?HD technology enables traditional PCB With Stuffing Options:AB-Amplifier performance(<0.03%THD)levels while –Mono Parallel Bridge Tied Load(PBTL)providing the power efficiency of traditional class D
amplifiers.
–Stereo Bridge Tied Load(BTL)
Unlike traditional Class D amplifiers,the distortion – 2.1Single Ended Stereo Pair and Bridge
curve only increases once the output levels move into Tied Load Subwoofer
clipping.
–Quad Single Ended Outputs
PurePath?HD technology enables lower idle losses ?Total Output Power at10%THD+N
making the device even more efficient.Coupled with –600W in Mono PBTL Configuration TI’s Class G power supply reference design for
–300W per Channel in Stereo BTL TAS563x,industry leading levels of efficiency can be Configuration achieved.
–145W per Channel in Quad Single Ended
Configuration
?High Efficiency Power Stage(>88%)With
60-m?Output MOSFETs
?Two Thermally Enhanced Package Options:
–PHD(64-Pin QFP)
–DKD(44-Pin PSOP3)
?Self-Protection Design(Including
Undervoltage,Overtemperature,Clipping,and
Short-Circuit Protection)With Error Reporting
?EMI Compliant When Used With
Recommended System Design
(1)Achievable output power levels are dependent on the thermal
configuration of the target application.A high performance
thermal interface material between the package exposed
heatslug and the heat sink should be used to achieve high
output power levels.
Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Premier Pro,Power PAD are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.Copyright?2009,Texas Instruments Incorporated Products conform to specifications per the terms of the Texas
Instruments standard warranty.Production processing does not
necessarily include testing of all parameters.
Pin 1 Marker White Dot
P P G G N C N C N C N C P S U _R E F V D D GND_D
GND_C GND_C OUT_C OUT_C PVDD _C PVDD _C BST_C BST_B PVDD_B OUT_B GND_B GND_A G N D G N D G V D D _B G V D D _A B S T _A O U T _A O U T _A P V D D _A P V D D _A G N D _A
PVDD_B OUT_B GND_B DKD PACKAGE (TOP VIEW)
M3OC_ADJ VDD PSU_REF
M2M1READY
OTW SD OSC_IO-OSC_IO+FREQ_ADJ INPUT_D INPUT_C VREG AGND GND VI_CM INPUT_B INPUT_A C_STARTUP
RESET GND_C OUT_A BST_A OUT_B BST_B PVDD_B PVDD_A BST_C PVDD_C OUT_C GND_A GND_B OUT_D PVDD_D BST_D GND_D GVDD_AB GVDD_CD
PVDD_A PVDD_D OUT_D OUT_A PHD PACKAGE (TOP VIEW)
TAS5630
SLES220A –JUNE 2009–REVISED SEPTEMBER https://www.sodocs.net/doc/622012041.html,
This integrated circuit can be damaged by ESD.Texas Instruments recommends that all integrated circuits be handled with appropriate precautions.Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure.Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE INFORMATION
Terminal Assignment
The TAS5630is available in two thermally enhanced packages:?64-Pin QFP (PHD)Power Package ?44-Pin PSOP3package (DKD)
The package types contain heat slugs that are located on the top side of the device for convenient thermal coupling to the heat sink.
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TAS5630 https://www.sodocs.net/doc/622012041.html,.................................................................................................................................................SLES220A–JUNE2009–REVISED SEPTEMBER2009 MODE SELECTION PINS
MODE PINS OUTPUT
ANALOG INPUT DESCRIPTION
CONFIGURATION
M3M2M1
000Differential2×BTL AD mode
001——Reserved
010Differential2×BTL BD mode
Differential Single
0111×BTL+2×SE BD mode,BTL Differential
Ended
100Single Ended4×SE AD mode
INPUT_C(1)INPUT_D(1)
101Differential1×PBTL00AD mode
10BD mode 110
Reserved
111
(1)INPUT_C and D are used to select between a subset of AD and BD mode operations in PBTL mode(1=VREG and0=AGND).
PACKAGE HEAT DISSIPATION RATINGS(1)
PARAMETER TAS5630PHD TAS5630DKD RθJC(°C/W)–2BTL or4SE channels 2.63 1.4
RθJC(°C/W)–1BTL or2SE channel(s) 4.13 2.04 RθJC(°C/W)–1SE channel 6.45 3.45
Pad Area(2)64mm280mm2
(1)J C is junction-to-case,CH is case-to-heat sink
(2)RθCH is an important consideration.Assume a2-mil thickness of thermal grease with a thermal conductivity of2.5W/mK between the
pad area and the heat sink and both channels active.The RθCH with this condition is1.1°C/W for the PHD package and0.44°C/W for the DKD package.
Table1.ORDERING INFORMATION(1)
T A PACKAGE DESCRIPTION 0°C–70°C TAS5630PHD64pin HTQFP
0°C–70°C TAS5630DKD44pin PSOP3
(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TI
website at https://www.sodocs.net/doc/622012041.html,.
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
VALUE UNIT VDD to AGND–0.3to13.2V GVDD to AGND–0.3to13.2V PVDD_X to GND_X(2)–0.3to69V
OUT_X to GND_X(2)–0.3to69V
BST_X to GND_X(2)–0.3to82.2V
BST_X to GVDD_X(2)–0.3to69V VREG to AGND–0.3to4.2V
GND_X to GND–0.3to0.3V
GND_X to AGND–0.3to0.3V
OC_ADJ,M1,M2,M3,OSC_IO+,OSC_IO-,FREQ_ADJ,VI_CM,C_STARTUP,PSU_REF–0.3to4.2V
to AGND
INPUT_X–0.3to5V RESET,SD,OTW1,OTW2,CLIP,READY to AGND–0.3to7V Continuous sink current(SD,OTW1,OTW2,CLIP,READY)9mA Operating junction temperature range,T J0to150°C Storage temperature,T stg–40to150°C
Human body model(3)(all pins)±2kV Electrostatic discharge
Charged device model(3)(all pins)±500V
(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings
only,and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)These voltages represents the DC voltage+peak AC waveform measured at the terminal of the device in all conditions.
(3)Failure to follow good anti-static ESD handling during manufacture and rework will contribute to device malfunction.Please ensure
operators handling the device are adequately grounded through the use of ground straps or alternative ESD protection. RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range(unless otherwise noted)
MIN NOM MAX UNIT PVDD_x Half-bridge supply DC supply voltage255052.5V
Supply for logic regulators and gate-drive
GVDD_x DC supply voltage10.81213.2V circuitry
VDD Digital regulator supply voltage DC supply voltage10.81213.2V
R L(BTL) 3.54
Output filter according to schematics in
R L(SE)Load impedance 1.82?
the application information section
R L(PBTL) 1.62
L OUTPUT(BTL)710
L OUTPUT(SE)Output filter inductance Minimum output inductance at I OC715μH
L OUTPUT(PBTL)710
Nominal350400450 PWM frame rate selectable for AM
F PWM interference avoidance;1%Resistor AM1310340350kHz
tolerance.AM2250300320
Nominal;Master mode9.51010.5
R FREQ_ADJ PWM frame rate programming resistor AM1;Master mode19.82020.2k?
AM2;Master mode29.73030.3
Voltage on FREQ_ADJ pin for slave mode
V FREQ_ADJ Slave mode 3.3V operation
T J Junction temperature0150°C
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PIN FUNCTIONS
PIN
Function(1)DESCRIPTION
NAME PHD NO.DKD NO.
AGND810P Analog ground
BST_A5443P HS bootstrap supply(BST),external0.033μF capacitor to OUT_A required. BST_B4134P HS bootstrap supply(BST),external0.033μF capacitor to OUT_B required. BST_C4033P HS bootstrap supply(BST),external0.033μF capacitor to OUT_C required. BST_D2724P HS bootstrap supply(BST),external0.033μF capacitor to OUT_D required. CLIP18—O Clipping warning;open drain;active low
C_STARTUP35O Startup ramp requires a charging capacitor of4.7nF to AGND in BTL mode FREQ_ADJ1214I PWM frame rate programming pin requires resistor to AGND
7,23,24,57,
GND9P Ground
58
GND_A48,4938P Power ground for half-bridge A
GND_B46,4737P Power ground for half-bridge B
GND_C34,3530P Power ground for half-bridge C
GND_D32,3329P Power ground for half-bridge D
GVDD_A55—P Gate drive voltage supply requires0.1μF capacitor to GND_A
GVDD_B56—P Gate drive voltage supply requires0.1μF capacitor to GND_B
GVDD_C25—P Gate drive voltage supply requires0.1μF capacitor to GND_C
GVDD_D26—P Gate drive voltage supply requires0.1μF capacitor to GND_D
GVDD_AB—44P Gate drive voltage supply requires0.22μF capacitor to GND_A/GND_B
GVDD_CD—23P Gate drive voltage supply requires0.22μF capacitor to GND_C/GND_D INPUT_A46I Input signal for half bridge A
INPUT_B57I Input signal for half bridge B
INPUT_C1012I Input signal for half bridge C
INPUT_D1113I Input signal for half bridge D
M12020I Mode selection
M22121I Mode selection
M32222I Mode selection
NC59–62–—No connect,pins may be grounded.
Analog overcurrent programming pin requires resistor to AGND.64pin
OC_ADJ13O
package(PHD)=22kOhm.44pin PSOP3(DKD)=24kOhm
OSC_IO+1315I/O Oscillator master/slave output/input.
OSC_IO–1416I/O Oscillator master/slave output/input.
OTW—18O Overtemperature warning signal,open drain,active low.
OTW116—O Overtemperature warning signal,open drain,active low.
OTW217—O Overtemperature warning signal,open drain,active low.
OUT_A52,5339,40O Output,half bridge A
OUT_B44,4536O Output,half bridge B
OUT_C36,3731O Output,half bridge C
OUT_D28,2927,28O Output,half bridge D
PSU_REF631P PSU Reference requires close decoupling of330pF to AGND
Power supply input for half bridges A requires close decoupling of0.01μF PVDD_A50,5141,42P
capacitor in parallel with2.2μF capacitor to GND_A
Power supply input for half bridges B requires close decoupling of0.01μF PVDD_B42,4335P
capacitor in parallel with2.2μF capacitor to GND_B
Power supply input for half bridges C requires close decoupling of0.01μF PVDD_C38,3932P
capacitor in parallel with2.2μF capacitor to GND_C
(1)I=Input,O=Output,P=Power
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PIN FUNCTIONS(continued)
PIN
Function(1)DESCRIPTION
NAME PHD NO.DKD NO.
Power supply input for half bridges A requires close decoupling of0.01μF PVDD_D30,3125,26P
capacitor in parallel with2.2μF capacitor to GND_A
READY1919O Normal operation;open drain;active high
RESET24I Device reset Input;active low
SD1517O Shutdown signal,open drain,active low
Power supply for digital voltage regulator requires a10-μF capacitor in parallel VDD642P
with a0.1-μF capacitor to GND for decoupling.
VI_CM68O Analog comparator reference node requires close decoupling of1nF to AGND VREG911P Digital regulator supply filter pin requires0.1-μF capacitor to AGND
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TAS5630 https://www.sodocs.net/doc/622012041.html,.................................................................................................................................................SLES220A–JUNE2009–REVISED SEPTEMBER2009 TYPICAL SYSTEM BLOCK DIAGRAM
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M1
M2/RESET
/SD
/OTW2
AGND
OC_ADJ
VREG
VDD
GVDD_A
M3
GND
INPUT_D
OUT_A GND_A PVDD_A
BST_A
GVDD_B
INPUT_C
OUT_B
GND_B PVDD_B
BST_B GVDD_C OUT_C
GND_C PVDD_C
BST_C
GVDD_D OUT_D GND_D
PVDD_D
BST_D
INPUT_B
INPUT_A
VI_CM
C_STARTUP
FREQ_ADJ
OSC_SYNC_IO-PSU_REF
OSC_SYNC_IO+/OTW1READY /CLIP TAS5630
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FUNCTIONAL BLOCK DIAGRAM
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AUDIO CHARACTERISTICS(BTL)
PCB and system configuration are in accordance with recommended guidelines.Audio frequency=1kHz,PVDD_X=50V, GVDD_X=12V,R L=4?,f S=400kHz,R OC=22k?,T C=75°C,Output Filter:L DEM=7μH,C DEM=680nF,
MODE=010,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
R L=4?,10%THD+N,clipped output signal300
R L=6?,10%THD+N,clipped output signal210
R L=8?,10%THD+N,clipped output signal160
P O Power output per channel W
R L=4?,1%THD+N,unclipped output signal240
R L=6?,1%THD+N,unclipped output signal160
R L=8?,1%THD+N,unclipped output signal125
THD+N Total harmonic distortion+noise1W0.03%
A-weighted,AES17filter,Input Capacitor
V n Output integrated noise270μV
Grounded
|V OS|Output offset voltage Inputs AC coupled to AGND40150mV SNR Signal-to-noise ratio(1)A-weighted,AES17filter100dB DNR Dynamic range A-weighted,AES17filter100dB
P idle Power dissipation due to Idle losses(I PVDD_X)P O=0,4channels switching(2) 2.7W
(1)SNR is calculated relative to1%THD+N output level..
(2)Actual system idle losses also are affected by core losses of output inductors.
AUDIO SPECIFICATION(Single-Ended Output)
PCB and system configuration are in accordance with recommended guidelines.Audio frequency=1kHz,PVDD_X=50V, GVDD_X=12V,R L=4?,f S=400kHz,R OC=22k?,T C=75°C,Output Filter:L DEM=15μH,C DEM=470μF,
MODE=100,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
R L=2?,10%THD+N,clipped output signal145
R L=3?,10%THD+N,clipped output signal100
R L=4?,10%THD+N,clipped output signal75
P O Power output per channel
R L=2?,1%THD+N,unclipped output signal110W
R L=3?,1%THD+N,unclipped output signal75
R L=4?,1%THD+N,unclipped output signal55
THD+N Total harmonic distortion+noise1W0.07%
A-weighted,AES17filter,Input CapacitorμV
V n Output integrated noise340
Grounded
SNR Signal to noise ratio(1)A-weighted,AES17filter93dB DNR Dynamic range A-weighted,AES17filter93dB
P idle Power dissipation due to idle losses(I PVDD_X)P O=0,4channels switching(2)2W
(1)SNR is calculated relative to1%THD+N output level.
(2)Actual system idle losses are affected by core losses of output inductors.
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AUDIO SPECIFICATION(PBTL)
PCB and system configuration are in accordance with recommended guidelines.Audio frequency=1kHz,PVDD_X=50V, GVDD_X=12V,R L=2?,f S=400kHz,R OC=22k?,T C=75°C,Output Filter:L DEM=7μH,C DEM=1.5μF,
MODE=101-10,unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
R L=2?,10%THD+N,clipped output signal600
R L=3?,10%THD+N,clipped output signal400
R L=4?,10%THD+N,clipped output signal300
P O Power output per channel W
R L=2?,1%THD+N,unclipped output signal480
R L=3?,1%THD+N,unclipped output signal310
R L=4?,1%THD+N,unclipped output signal230
THD+N Total harmonic distortion+noise1W0.05%
V n Output integrated noise A-weighted260μV SNR Signal to noise ratio(1)A-weighted100dB DNR Dynamic range A-weighted100dB
P idle Power dissipation due to idle losses(IPVDD_X)P O=0,4channels switching(2) 2.7W
(1)SNR is calculated relative to1%THD-N output level.
(2)Actual system idle losses are affected by core losses of output inductors.
ELECTRICAL CHARACTERISTICS
PVDD_X=50V,GVDD_X=12V,VDD=12V,T C(Case temperature)=75°C,f S=400kHz,unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INTERNAL VOLTAGE REGULATOR AND CURRENT CONSUMPTION
Voltage regulator,only used as reference
VREG VDD=12V3 3.3 3.6V node,VREG
VI_CM Analog comparator reference node,VI_CM 1.5 1.75 1.9V
Operating,50%duty cycle22.5
I VDD VDD supply current mA
Idle,reset mode22.5
50%duty cycle12.5
I GVDD_X GVDD_x gate-supply current per half-bridge mA
Reset mode 1.5
50%duty cycle with recommended output
13.3mA
filter
I PVDD_X Half-bridge supply current
Reset mode,No switching870μA ANALOG INPUTS
R IN Input resistance READY=HIGH33k?
V IN Maximum input voltage swing5V
I IN Maximum input current342μA
G Voltage Gain(V OUT/V IN)23dB OSCILLATOR
Nominal,Master Mode 3.54 4.5
f OSC_IO+AM1,Master Mode F PWM×10 3.1 3.4 3.5MHz
AM2,Master Mode 2.63 3.2
V IH High level input voltage 1.86V
V IL Low level input voltage 1.45V OUTPUT-STAGE MOSFETs
Drain-to-source resistance,low side(LS)60100m?
T J=25°C,excludes metallization
R DS(on)
resistance,GVDD=12V
Drain-to-source resistance,high side(HS)60100m?
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ELECTRICAL CHARACTERISTICS(continued)
PVDD_X=50V,GVDD_X=12V,VDD=12V,T C(Case temperature)=75°C,f S=400kHz,unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT I/O PROTECTION
Undervoltage protection limit,GVDD_x and
V uvp,G9.5V VDD
V uvp,hyst(1)0.6V OTW1(1)Overtemperature warning195100105°C OTW2(1)Overtemperature warning2115125135°C Temperature drop needed below OTW
OTW hyst(1)temperature for OTW to be inactive after25°C OTW event.
Overtemperature error145155165°C OTE(1)
OTE-OTW differential30°C
A reset needs to occur for SD to be released
OTE hyst(1)25°C following an OTE event
OLPC Overload protection counter f PWM=400kHz 1.3ms
Resistor–programmable,nominal peak
current in1?load,
19A
64Pin QFP package(PHD)
R OCP=22k?
Overcurrent limit protection
Resistor–programmable,nominal peak
I OC current in1?load,
19A
44Pin PSOP3package(DKD),
R OCP=24k?
Resistor–programmable,nominal peak
current in1?load,
Overcurrent limit protection,Latched19A
R OCP=47k?
Time from switching transition to flip-state
I OCT Overcurrent response time150ns
induced by overcurrent
Connected when RESET is active to
Internal pulldown resistor at output of each
I PD provide bootstrap charge.Not used in SE3mA
half bridge
mode.
STATIC DIGITAL SPECIFICATIONS
V IH High level input voltage2V
INPUT_X,M1,M2,M3,RESET
V IL Low level input voltage0.8V
I lkg Input leakage current100μA OTW/SHUTDOWN(SD)
Internal pullup resistance,OTW1to VREG,
R INT_PU202632k?OTW2to VREG,SD to VREG
Internal pullup resistor3 3.3 3.6
V OH High level output voltage V
External pullup of4.7k?to5V 4.55
V OL Low level output voltage I O=4mA200500mV
Device fanout OTW1,OTW2,SD,CLIP,
FANOUT No external pullup30devices READY
(1)Specified by design.
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034020406080100120140160180200220240260280300320
PVDD - Supply Voltage - V
P - O u t p u t P o w e r - W
O 0.005
10
0.010.020.050.10.20.512520m
400
100m200m 125102050100
T H D +N - T o t a l H a r
m o n i c D i s t o r t i o n + N o i s e - %
P - Output Power - W
O 0
1005101520253035404550556065707580859095
2 Channel Output Power - W
E f f i c i e n c y - %
030020406080100120140160180200220240
260280
PVDD - Supply Voltage - V
P - O u t p u t P o w e r - W
O TAS5630
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TYPICAL CHARACTERISTICS,BTL CONFIGURATION
TOTAL HARMONIC+NOISE
OUTPUT POWER
vs
vs
OUTPUT POWER
SUPPLY VOLTAGE
Figure 1.
Figure 2.UNCLIPPED OUTPUT POWER
SYSTEM EFFICIENCY
vs
vs
SUPPLY VOLTAGE
OUTPUT POWER
Figure 3.Figure 4.
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P - O u t
p u t P o w e r - W
O T - Case Temperature - °C
C 0
80510152025303540455055
606570752 Channel Output Power - W
P o w e r
L o s s - W
+00k
4k 6k
8k 10k 12k 14k 16k 22k f - Frequency - Hz N o i s e A m p l i t u d e - d B
2k 20k TAS5630
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TYPICAL CHARACTERISTICS,BTL CONFIGURATION (continued)
SYSTEM POWER LOSS
OUTPUT POWER
vs
vs
OUTPUT POWER
CASE TEMPERATURE
Figure 5.
Figure 6.
NOISE AMPLITUDE
vs
FREQUENCY
Figure 7.
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0.005
10
0.01
0.020.050.10.20.5125
P - Output Power - W
O T H D +N - T o t a l H a r m o n i c D i s t o r t i o n + N o i s e - %
PVDD - Supply Voltage - V
P - O u t p u t P o w e r - W
O
P - O u t p u t P o w e r - W
O T - Case Temperature - °C
C TAS5630
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TYPICAL CHARACTERISTICS,SE CONFIGURATION
TOTAL HARMONIC DISTORTION +NOISE
OUTPUT POWER
vs
vs
OUTPUT POWER
SUPPLY VOLTAGE
Figure 8.
Figure 9.
OUTPUT POWER
vs
CASE TEMPERATURE
Figure 10.
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0.005
10
0.01
0.020.050.10.20.5125
T H D +N - T o t a l H a r m o n i c D i s t o r t i o n + N o i s e - %
P - Output Power - W
O 0650
50100150200250300350400450500
550600PVDD - Supply Voltage - V
P - O u t p u t P o w e r
- W
O P - O u t p u t P o w e r - W
O T - Case Temperature - °C
C TAS5630
https://www.sodocs.net/doc/622012041.html, .................................................................................................................................................SLES220A –JUNE 2009–REVISED SEPTEMBER 2009
TYPICAL CHARACTERISTICS,PBTL CONFIGURATION
TOTAL HARMONIC DISTORTION +NOISE
OUTPUT POWER
vs
vs
OUTPUT POWER
SUPPLY VOLTAGE
Figure 11.
Figure 12.
OUTPUT POWER
vs
CASE TEMPERATURE
Figure 13.
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APPLICATION INFORMATION
PCB MATERIAL RECOMMENDATION
FR-4Glass Epoxy material with2oz.(70μm)is recommended for use with the TAS5630.The use of this material can provide for higher power output,improved thermal performance,and better EMI margin(due to lower PCB trace inductance).
PVDD CAPACITOR RECOMMENDATION
The large capacitors used in conjunction with each full-bridge,are referred to as the PVDD Capacitors.These capacitors should be selected for proper voltage margin and adequate capacitance to support the power requirements.In practice,with a well designed system power supply,1000μF,63V will support more applications.The PVDD capacitors should be low ESR type because they are used in a circuit associated with high-speed switching.
DECOUPLING CAPACITOR RECOMMENDATIONS
To design an amplifier that has robust performance,passes regulatory requirements,and exhibits good audio performance,a quality decoupling capacitors should be used.In practice,X7R should be used in this application. The voltage of the decoupling capacitors should be selected in accordance with good design practices. Temperature,ripple current,and voltage overshoot must be considered.This fact is particularly true in the selection of the2.2μF that is placed on the power supply to each half-bridge.It must withstand the voltage overshoot of the PWM switching,the heat generated by the amplifier during high power output,and the ripple current created by high power output.A minimum voltage rating of63V is required for use with a50V power supply.
SYSTEM DESIGN RECOMMENDATIONS
The following schematics and PCB layouts illustrate best practices used for the TAS5630.
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I N _L E F T _
I N _L E F T _P
R _R I G H T _I N _R I G H T _/R E S E 2V )
P V D D
G N D TAS5630
https://www.sodocs.net/doc/622012041.html, .................................................................................................................................................SLES220A –JUNE 2009–REVISED SEPTEMBER 2009
Figure 14.Typical Differential Input BTL Application With BD Modulation Filters
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I N _
I N _/R E S E /S /O T /O T /C L R E A V D D (+12V )
V D D
O S C _I O S C _I V D D (+12V TAS5630
SLES220A –JUNE 2009–REVISED SEPTEMBER https://www.sodocs.net/doc/622012041.html,
Figure 15.Typical Differential (2N)PBTL Application With BD Modulation Filters
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R V D D (+12V )
P V D D
O O D (+12V )V D D (+D
D TAS5630
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Figure 16.Typical SE Application
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I N _C E N T E R _N
I N _C E N T E R _P
I N _R I G H
I N _L E F /R E S E //O T /O T /C L R E A 12V )
O S C _I O S C _I V D D (+12TAS5630
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Figure 17.Typical 2.1System Differential Input BTL and Unbalanced Input SE Application
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