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合泰IC封装大全

合泰IC封装大全
合泰IC封装大全

Package Types

The following are the package Types and widths offered by Holtek.

DIP (Dual In-line Package)

Pin count: 8, 14, 16, 18, 20, 24, 28, 32, 40, 42, 48

SKDIP (Skinny Dual In-line Package)

Pin count: 22, 24, 28

SOP (Small Outline Package)

Pin count: 8, 14, 16, 18, 20, 24, 28, 32

SOP (Small Outline Package)

Thermally Enhanced (Exposed Pad)

Pin count: 8

NSOP (Narrow Small Outline Package)

Pin count: 16

SSOP (Shrink Small Outline Package)

Pin count: 16, 20, 24, 28, 30, 48, 56

TSSOP (Thin Shrink Small Outline Package)

Pin count: 8, 14, 16, 20, 24, 48, 8MSOP, 10MSOP

TSSOP (Thin Shrink Small Outline Package)

Thermally Enhanced (Exposed Pad)

Pin count: 14, 16, 28, 8MSOP, 10MSOP

QFP (Quad Flat Package)

Pin count: 44, 52, 64, 80, 100, 128, 208

LQFP (Low profile Quad Flat Package)

Pin count: 32, 44, 48, 52, 64, 80, 100, 128, 144, 216

TQFP (Thin Quad Flat Package)

Pin count: 44, 48, 100

TQFP (Thin Shrink Small Outline Package)

Thermally Enhanced (Exposed Pad)

Pin count: 48Punched Type QFN (Quad Flat No-lead) Pin count: 48, 64

SAW Type QFN (Quad Flat No-lead) Pin count: 16, 20, 24, 32, 40, 46, 48, 56 DFN Type (Quad Flat No-lead)

Pin count: 8

PLCC (Plastic Leaded Chip Carrier Package) Pin count: 32, 44

SOT23, SOT223

Pin count: 3

SOT23-5, TSOT23-5

Pin count: 5

SOT23-6

Pin count: 6

SOT89

Pin count: 3, 5

TO92

Pin count: 3

TO220, TO252, TO263

Pin count: 3

SIP

Pin count: 4

MSOP

Pin count: 8, 10

Packaging Diagrams and Parameters (for Reference Only)

Plastic DIP/SKDIP/SDIP Outline Dimensions

Fig1. Full Lead Packages Fig2. 1/2 Lead Packages

SOP/NSOP Outline Dimensions

SOP Outline Dimensions for Thermally Enhanced Variations Only (Exposed Pad)

SSOP Outline Dimensions

TSSOP Outline Dimensions

TSSOP Outline Dimensions for Thermally Enhanced Variations Only (Exposed Pad)

173mil TSSOP_EP

QFP/LQFP/TQFP Outline Dimensions

TQFP Outline Dimensions for Thermally Enhanced Variations Only (Exposed Pad)

Punched Type QFN Outline Dimensions

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