Package Types
The following are the package Types and widths offered by Holtek.
DIP (Dual In-line Package)
Pin count: 8, 14, 16, 18, 20, 24, 28, 32, 40, 42, 48
SKDIP (Skinny Dual In-line Package)
Pin count: 22, 24, 28
SOP (Small Outline Package)
Pin count: 8, 14, 16, 18, 20, 24, 28, 32
SOP (Small Outline Package)
Thermally Enhanced (Exposed Pad)
Pin count: 8
NSOP (Narrow Small Outline Package)
Pin count: 16
SSOP (Shrink Small Outline Package)
Pin count: 16, 20, 24, 28, 30, 48, 56
TSSOP (Thin Shrink Small Outline Package)
Pin count: 8, 14, 16, 20, 24, 48, 8MSOP, 10MSOP
TSSOP (Thin Shrink Small Outline Package)
Thermally Enhanced (Exposed Pad)
Pin count: 14, 16, 28, 8MSOP, 10MSOP
QFP (Quad Flat Package)
Pin count: 44, 52, 64, 80, 100, 128, 208
LQFP (Low profile Quad Flat Package)
Pin count: 32, 44, 48, 52, 64, 80, 100, 128, 144, 216
TQFP (Thin Quad Flat Package)
Pin count: 44, 48, 100
TQFP (Thin Shrink Small Outline Package)
Thermally Enhanced (Exposed Pad)
Pin count: 48Punched Type QFN (Quad Flat No-lead) Pin count: 48, 64
SAW Type QFN (Quad Flat No-lead) Pin count: 16, 20, 24, 32, 40, 46, 48, 56 DFN Type (Quad Flat No-lead)
Pin count: 8
PLCC (Plastic Leaded Chip Carrier Package) Pin count: 32, 44
SOT23, SOT223
Pin count: 3
SOT23-5, TSOT23-5
Pin count: 5
SOT23-6
Pin count: 6
SOT89
Pin count: 3, 5
TO92
Pin count: 3
TO220, TO252, TO263
Pin count: 3
SIP
Pin count: 4
MSOP
Pin count: 8, 10
Packaging Diagrams and Parameters (for Reference Only)
Plastic DIP/SKDIP/SDIP Outline Dimensions
Fig1. Full Lead Packages Fig2. 1/2 Lead Packages
SOP/NSOP Outline Dimensions
SOP Outline Dimensions for Thermally Enhanced Variations Only (Exposed Pad)
SSOP Outline Dimensions
TSSOP Outline Dimensions
TSSOP Outline Dimensions for Thermally Enhanced Variations Only (Exposed Pad)
173mil TSSOP_EP
QFP/LQFP/TQFP Outline Dimensions
TQFP Outline Dimensions for Thermally Enhanced Variations Only (Exposed Pad)
Punched Type QFN Outline Dimensions