EHP-A23-RGB33-PU5-TR datasheet
Features
Applications
Feature of the device: Small package
with high efficiency
Typical view angle: 120° ESD protection.
Soldering methods: SMT
Grouping parameter: Brightness,
Forward Voltage and. wavelength Moisture Sensitivity Level: 3
The product itself will remain within RoHS
compliant version.
Interior automotive lighting
(e.g. dashboard backlighting)
Decorative and entertainment lighting
(incl. fiber optic illumination) Reading light (aircraft, car, bus) Signal and symbol luminaries
Marker lights (e.g. steps, exit ways, etc.)
Materials
Items
Description
Encapsulating Resin Silicone resin
Electrodes Ag plating copper alloy Die attach Silver Paste Chip
G 、B ：InGaN R ：AlGaInP
EHP-A23/RGB33-PU5/TR
High Power LED – 0.5W
Dimensions
Notes.
1. Dimensions are in millimeters.
2. Tolerances for fixed dimensions are ± 0.25mm.
Maximum Ratings (T Soldering=25oC)
Parameter Symbol Rating Unit
DC Operating Current Rad
I F
60
mA Green 60
Blue 60
Pulsed Forward Current(1)Rad
I PF
100
mA Green 100
Blue 100
ESD Sensitivity ESD 2000 V
Junction Temperature T
j
110 °C
Operating Temperature T
op.
-40 ~ +85 °C
Storage Temperature T
stge.
-40 ~ +100 °C
Power Dissipation P
d
0.5 W Electro-Optical Characteristics (T Soldering=25oC)
Parameter Bin Symbol Min Typ. Max Uni
t
Condition
Brightness(2) Rad
Ф
v
8 ---- 12
lm
I F1=60Ma(R) (5
I F2=60Ma(G) (5)
I F3=60Ma(B) (5) Green 12 ---- 18
Blue 2 ---- 4
Forward Voltage(3)Rad
V F
1.8 ----
2.3
V Green 2.7 ---- 3.6
Blue 2.7 ---- 3.6
Wavelength(4)Rad
λ
d
615 ---- 625
nm Green 525 ---- 535
Blue 457 ---- 467
Note.
1. tp ≦100μs, Duty cycle = 0.25
2. Luminous Flux measurement tolerance: ±10%.
3. Forward Voltage measurement tolerance: ± 0.1V.
4. Wavelength measurement tolerance: ±1nm
5. White point coordinates varied with wavelength changing.
Relative Spectral Distribution,
I F =60mA, T soldering =25oC Forward Voltage vs Forward Current, T soldering =25oC Relative Luminous Intensity vs Forward Current, T soldering =25oC
Forward Current Derating Curve, Derating based on T j MAX =125°C
Typical Electro-Optical Characteristics Curves
R e l a t i v e L u m i n o u s I n t e n s i t y
Dominate Wavelength(nm)
Ambient Temperature (οC)
R e l a t i v e L u m i n o u s I n t e n s i t y
Forward Current (mA)
Forward Current (mA)
Typical Representative Spatial Radiation Pattern
F o r w a r d C u r r e n t (m A )
Ambient Temperature(o
C)
R e l a t i v e L u m i n o u s I n t e n s i t y
View Angle(degree)
Note.
1. 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value.
2. View angle tolerance is ± 5°.
Label explanation
CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Rank of Luminous Flux HUE: Color Rank
REF: Rank of Forward Voltage LOT No: Lot Number
MADE IN TAIWAN: Production Place
Reel Dimensions
Note.
1. Dimensions are in millimeters.
2.
Tolerances for fixed dimensions are ± 0.1mm.
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel
Note.
1. Dimensions are in millimeters.
Reliability Data
Stress Test Stress Condition Stress Duration
Solderability Tsol=260℃, 10sec 1 times Reflow Tsol=260℃, 5sec, 6min 3 times
Thermal Shock H：＋100℃20min.
'∫ 20sec.
'L：－10℃20min.
200 Cycles
Temperature Cycle H：＋100℃15min.
'∫ 5min.
'L：－40℃15min.
200 Cycles
High Temperature/Humidity
Reverse Bias
Ta=85℃ , RH=85% 1000hours
High Temperature/Humidity
Operation
Ta=85℃ , RH=85%, IF=120mA 1000hours High Temperature Storage Ta=85℃1000hours Low Temperature Storage Ta=-40℃1000hours High Temperature Operation
Life #1
Ta=25℃, IF=180mA 1000hours High Temperature Operation
Life #2
Ta=55℃, IF=180mA 1000hours High Temperature Operation
Life #3
Ta=85℃, IF=120mA 1000hours Low Temperature Operation
Life
Ta=-40℃, IF=180mA 1000hours
Power Temperature Cycle H：＋100℃15min.
'∫ 5min.
'L：－40℃15min.
IF=120mA,2min on/off
200cycles
*lm: BRIGHTNESS ATTENUATE DIFFERENCE(1000hrs)＜50% *VF: FORWARD VOLTAGE DIFFERENCE＜20%
Precautions For Use
1. Over-current-proof
Although the EHP-A23 series has a conductive ESD protection mechanism, customer must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shifts may cause significant current change resulting in burn out failure.
2. Storage
i. Do not open the moisture proof bag before the devices are ready to use.
ii. Before the package is opened, LEDs should be stored at temperatures less than 30℃and humidity less than 90%.
iii. LEDs should be used within a year.
iv. After the package is opened, LEDs should be stored at temperatures less than 30℃and humidity less than 60%.
v. LEDs should be used within 168 hours (7 days) after the package is opened.
vi. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the storage time, baking treatment should be implemented based on the
following conditions: pre-curing at 60±5℃for 24 hours.
3. Thermal Management
i. For maintaining the high flux output and achieving reliability, EHP-A23 series LEDs
should be mounted on a metal core printed circuit board (MCPCB) or other kinds of
heat sink with proper thermal connection to dissipate approximately 1W of thermal
energy at 180mA operation.
ii. Heat dissipation or thermal conduction design is strongly recommended on PCB or MCPCB for reflow soldering purposes. Please refer to soldering patterns on Page 2.
iii. Sufficient thermal management must be implemented. Otherwise, the junction temperature of die may exceed over the limit at high current driving conditions and the
LEDs’ lifetime may be decrease dramatically.
iv. For further thermal management suggestions, please consult the Everlight Design Guide or local representatives for assistance.
v. Special thermal designs are also recommended to take in outer heat sink design, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal
conductive adhesive, etc.
vi. Sufficient thermal management must be conducted, or the die junction temperature will be over the limit under large electronic driving and LED lifetime will decrease critically.
4. Proper Handling
To avoid contamination of materials, damage of internal components, and shortening of LED lifetime, do not subject LEDs to conditions as those listed below.
Bare Hand
Tweezers
When handling the product, do not apply direct pressure on the resin.
Do not touch the resin to avoid scratching or other damage.
Pick and Place Nozzle for Surface Mount Assembly.
During Module Assembly
Avoid directly contacting with nozzle.
Do not stack the modules together, it could damage the resin or scratch the lens.
5. Soldering Iron
i. For Reflow Process
a. EHP-A23 series are suitable for SMT process.
b. Curing of glue in oven according to standard operation flow processes.
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not warp the circuit board.
ii. For Manual Soldering Process
a. For prototype builds or small series production runs it is possible to place and solder the
LED by hand.
b. Dispense thermal conductive glue or grease on the substrates and follow its curing
specifications. Gently press LED housing to closely connect LED and substrate.
c. It is recommended to hand solder the leads with a solder tip temperature of 280°C for
less than 3 second, at a time with a soldering iron of less than 25W. Solder at intervals of two seconds or more.
d. Take caution and be aware that damaged products are often a result of improper hand
soldering technique.
Revision History
Page Subjects(major change in previous version) Date of change
Prepared date:18-May-2012 Device No.:DHE-0001855
Created by:Betty Hong Rev.:1
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